Brominated Flame Retardants (BFRs) have successfully been used in electronic products for decades to reduce fire-related injury and damage, however many companies have chosen non-Halogen based flame retardants in Printed Circuit Board (PCBs) to meet their performance and sustainability requirements.To get more news about Halogen Free PCB, you can visit pcbmake official website.
While it is not yet legislated that electronic component suppliers must remove brominated and chlorinated flame retardants from their materials, Isola offers a variety of high performance non-halogenated prepregs and laminates to meet the electronic industry’s increased performance demands and marketing requirements for environmentally-friendly designs. Additionally, Isola materials are engineered for thermal reliability to stand up to the rigors of soldering conditions and chemical resistance to survive etching and plating operations.
Experience in producing halogen-free PCB
Halogen free panel supplier
Currently, a large number of panel suppliers have developed or are developing halogen-free copper clad sheets and corresponding semi-cured sheets, such as Polyclad pcl-fr-226/240, Isola DEl04TS, S1155 / S0455, South Asia, hongren ga-hf and panasonic electrician GX series.
In 2002, our company has started to use Polyclad pcl-fr-226/240 panels in batch for the production of mobile phone panels. This year, we have developed shengyis S1155 substrate and the production of multi-layer panels. Besides, the halogen-free panels in South Asia are also on trial.At present, the use of halogen-free plate has accounted for 20% of our total plate consumption.
Lamination parameters may vary from company to company.In the case of the above mentioned shengyi substrate and PP as a multi-layer board, in order to ensure the full flow of resin, so that the bonding force is good, the requirements of a low rate of plate material temperature (1.0-1.5℃ / min) and multi-stage pressure coordination, in addition to the high temperature stage requires a long time, 180℃ to maintain more than 50 minutes.The following is a recommended set of pressing procedures and the actual plate temperature.The bonding force between copper foil and substrate was 1.ON/mm for the pressed plate, and no stratification or bubble appeared after six thermal shocks.